Essential for thermal management Thermal interface material for reliable heat dissipation in electronics
The right thermal interface material improves thermal contact between the heat sink and the electronic component. It compensates for unevenness and protects your electronics from overheating and loss of performance.
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Why choose thermal interface material from CTX?
Find out more about CTX’s thermal conductive materials in our flyer.
Thermal Interface Materials von CTX
We supply suitable thermal interface materials (TIM) that minimise thermal resistance. Our range includes all types of thermal interface materials, which you can select based on properties such as thickness, thermal conductivity or dielectric strength. Using our die-cutting technology, we cut the thermal interface material precisely to the specifications in your drawings. Our TIMs are available loose or pre-assembled with your heat sink.
On request, we can assist you with the design and, based on your thermal data, determine the most suitable thermal interface material and its geometry. In doing so, you benefit from our experience in the development of efficient cooling solutions.
- We are a full-service provider of thermal interface materials.
- We supply a wide range of TIMs, enabling designs tailored precisely to your application.
- We manufacture precision-cut pieces to your drawings.
- We supply your thermal interface material in bulk, on a substrate or pre-assembled.
- On request, we can assist you with the design.
Where are heat-conducting materials used?
Wherever heat sinks in an electronic component dissipate heat from a hotspot, thermal interface materials support this process. The surface of the heat sink has microscopic irregularities. Where the electronic component comes into contact with the cooling solution, this creates insulating air pockets that impair heat transfer. Thermal interface material fills these irregularities and displaces the air. As a result, the resulting waste heat can be dissipated more efficiently into the heat sink.
Power electronics benefit from this across all areas of application: from 24/7 operation in power supply systems to confined installation spaces with high power density in electric mobility, CTX’s thermal interface materials support trouble-free operation with minimal power loss.
CTX thermal interface material is used in, amongst other things:
- LED modules in electric mobility
- inverters for the conversion of renewable energy
- switched-mode power supplies for power supply
- active and passive cooling concepts for embedded systems
- diagnostic systems with high-performance processors in medical technology
Key thermal conductive materials from CTX and their benefits
CTX supplies every type of thermal conductive material, precisely tailored to your application and process: we cut your chosen material to size in accordance with your specifications. You will receive your cut-to-size pieces packed on mats or in blister trays, or pre-assembled with the heat sink.
FAQ: Frequently Asked Questions about Thermal Interface Materials
Thermal interface materials are thermally conductive substances used for heat transfer in electronics. They fill any gaps between a heat sink and an electronic component (such as a circuit).
TIM is an abbreviation standing for Thermal Interface Material. It describes how it works: it is a material that ensures thermal optimisation at the interface between two components (electronics and heat sink).
Thermal interface materials are used to improve contact between electronic components and cooling systems. In this way, they help to dissipate the heat generated.
TIMs are necessary to replace insulating air gaps. They reduce thermal resistance and thereby increase the amount of heat dissipated.
A good thermal interface material has high thermal conductivity as well as good compressibility, so that it can fully compensate for any unevenness between the heat sink and the electronics. Thermal stability ensures that it retains its structure even at different temperatures. Its electrical properties are crucial if it is to be used for electrical insulation or as an electrical connection.
The choice of thermal interface material should be based on the installation situation and the operating conditions. The decisive factor is the size of the air gap that needs to be bridged between the electronic component and the heat sink. Other important aspects include the temperatures to which the TIM is exposed and, of course, the power dissipation that needs to be dissipated.
In power electronics, three categories of TIM are most widely used: gap fillers and thermal pads are particularly suitable as thermal interface materials for large gaps between electronic components and cooling solutions, owing to their good mouldability. Thermal pastes have high thermal conductivity but present disadvantages in terms of handling and application. Graphite is particularly suitable for applications requiring exceptionally long operating times due to its high performance characteristics.
The layer of thermal pads should be as thin as possible, but as thick as necessary. As a rule of thumb, they should be able to compress to between about 10 and almost 50 per cent of their thickness. In this way, they completely fill the air gap between the heat sink and the electronics and ensure efficient heat transfer.
In many electrical applications, electrically insulating TIMs are preferred in order to prevent short circuits. Electrically conductive materials such as graphite are used specifically where electrical insulation is not required.
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