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The skived fin process Ideal for small dimensions

Electronic systems with heights of less than 30 mm – including primarily industrial computers with very small cases (small form factor systems) – and CPUs in server systems have very stringent requirements for the specific power density of a heat sink. Typical cooling solutions for this application are skived fin heat sinks in combination with system fans. 

How it works

In the skived fin process the heat sink is pared out of an aluminum or copper block. This produces heat sinks with high density on very fine fins, which are directly connected to the heat sink base. 

The benefits

  • No thermal resistance at the transition between the heat sink base and the fins 
  • Excellent cooling effect
  • Very thin and long fins are possible
  • High fin density
  • Low tool costs
  • Suitable for small series

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