In electronic components, there is a trend toward more power in less space. However, this produces a negative side effect: The higher power loss generates more heat that needs to be dissipated. The large heat-conducting surface of fin heat sinks enables fast and efficient cooling of power electronics. They can be manufactured using various processes: Skived fins, manufactured using a long-established process at CTX, are ideal for high-performance electronics requiring effective heat transfer.
Heat sinks with high specific power density
Skiving is a process in which the cooling fins are carved from a single aluminum or copper block, with no interruption in the connection between the fins and the heat sink. This produces high-density heat sinks with very fine and high fins that are directly connected with the heat sink base. The process also ensures high specific power density.
New skiving machine for even higher heat sink performance
A new skiving machine now allows CTX to manufacture high-performance heat sinks with even higher and finer fins, while reducing the distance between the single fins. The following maximum parameters for copper or aluminum heat sinks can be achieved with the machine:
- Fin thickness: Al: 0.1 – 2.0 mm; Cu: 0081 mm – 2.0 mm
- Length of heat sink: Al and Cu: 10 mm – 2,900 mm
- Width of heat sink: Al and Cu: 10 mm – 900 mm
- Fin height: Al and Cu: 1 mm – 180 mm
- Distance between fin centers: Al: 0.2 –12 mm; Cu: 0.16 mm – 12 mm.
The new dimensions represent a substantial improvement over previous capabilities. If required, skived fin heat sinks can also be CNC machined to improve the flow path through different fin orientations, therefore fulfilling more stringent cooling requirements.